Daniel Sills
Papers
3
Total Citations
19
H-Index
2
About
Daniel Sills is a rising innovator at the intersection of flexible electronics, additive manufacturing, and soft robotics. His research centers on developing novel fabrication techniques—primarily inkjet and aerosol jet printing—to create high-performance, low-cost sensors and custom-packaged microelectromechanical systems (MEMS). Sills’s most cited work introduces a groundbreaking "fingerprint"-inspired organic piezoresistive tactile sensor, fabricated on a flexible substrate. This spiral-shaped sensor is scaled into a 16-unit "SkinCell" array, offering a new paradigm for robotic tactile sensing. With 15 citations since 2023, this work has already captured significant attention for its biomimetic design and practical scalability. Sills further demonstrates his impact through the development of the NeXus system, a robotic additive manufacturing platform that enables rapid prototyping of multiscale flexible printed circuit boards (FPCs). His contributions to die-level packaging via hybrid printing methods also promise to reduce costs and complexity in MEMS integration. By bridging advanced manufacturing with functional device design, Daniel Sills is paving the way for more accessible, customizable, and intelligent flexible electronic systems.
Research Focus
Key Achievements
Top Papers
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