John Naber
Papers
1
Total Citations
2
H-Index
1
About
John Naber is a leading researcher in advanced microelectronics packaging and additive manufacturing for MEMS devices. His work focuses on developing low-cost, scalable alternatives to traditional semiconductor packaging methods, particularly through the innovative use of inkjet and aerosol jet printing technologies. Naber’s major contributions include pioneering die-level packaging techniques that enable the direct fabrication of functional interconnects on custom MEMS devices assembled onto printed circuit boards. His 2024 study on “Aerosol Jet and Inkjet Printing Methods for Die-Level Packaging of Custom MEMS Devices” demonstrates a novel stacked structure approach that reduces manufacturing complexity and cost while maintaining reliability. Although early in its citation impact, this work represents a significant step toward democratizing MEMS packaging for prototyping and small-scale production. Naber’s research bridges the gap between traditional microfabrication and flexible, digital printing processes, offering practical solutions for integrating sensors and actuators into everyday electronics. His contributions are particularly valuable for researchers and engineers seeking to accelerate development cycles and lower barriers to entry in custom MEMS applications.
Research Focus
Key Achievements
Top Papers
- 1