Michael Sassa
Papers
1
Total Citations
2
H-Index
1
About
Michael Sassa is a rising figure in advanced manufacturing, with a focus on additive packaging technologies for microelectromechanical systems (MEMS). His work bridges the gap between custom device fabrication and scalable, cost-effective integration. In his most-cited study, Sassa demonstrates a novel approach to die-level packaging by combining inkjet and aerosol jet printing (AJP) to create functional interconnects on printed circuit boards. This method offers a low-cost alternative to traditional packaging, enabling the assembly of stacked structures without the need for expensive cleanroom processes. Though early in his career, with his 2024 paper already garnering attention, Sassa’s contributions are poised to impact the field of flexible and hybrid electronics. His research is particularly valuable for students and engineers seeking to reduce production costs while maintaining performance in MEMS packaging. As additive manufacturing continues to evolve, Sassa’s work represents a practical step toward democratizing custom device assembly.
Research Focus
Key Achievements
Top Papers
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