Kevin Walsh

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About

Kevin Walsh is a leading figure in advanced microelectronics packaging, with a primary focus on developing low-cost, scalable fabrication techniques for microelectromechanical systems (MEMS) and custom semiconductor devices. His most influential work demonstrates a novel hybrid approach combining aerosol jet printing (AJP) and inkjet printing to create functional interconnects for die-level packaging assembled directly on printed circuit boards (PCBs). This method offers a compelling alternative to traditional packaging by eliminating expensive lithographic steps and enabling rapid prototyping of stacked, custom structures. While his highly cited paper on this topic has garnered early attention, Walsh’s broader contributions lie in pioneering additive manufacturing processes that bridge the gap between lab-scale MEMS development and practical, low-volume production. His research is particularly impactful for applications requiring heterogeneous integration and bespoke packaging, where conventional methods are cost-prohibitive. By demonstrating that printed interconnects can achieve reliable performance in stacked configurations, Walsh is helping to democratize access to advanced packaging technologies for researchers and small-scale manufacturers.