Papers

21

Total Citations

174

H-Index

8

About

Danming Wei is a robotics and microsystems researcher whose work spans tactile sensing, microrobotics, and precision assembly. His research has made significant contributions to the development of electronic skin technologies, pioneering cost-effective fabrication methods for piezoresistive tactile sensors designed to enhance physical human-robot interaction. Notably, his work on inkjet-printed organic sensors using PEDOT:PSS inks represents a forward-thinking shift toward scalable, flexible manufacturing of robotic skin arrays, with his 2023 "fingerprint" sensor design garnering 15 citations. Wei is equally recognized for his innovations in untethered microrobotics. His ChevBot—a laser-powered submillimeter robot driven by thermal MEMS actuation—has attracted 19 citations and inspired follow-on work including the SolarPede, a light-powered micro-crawler targeting microfactory environments. His multiphysics modeling methodology further strengthened the theoretical foundations underpinning these platforms. Beyond individual robots, Wei has contributed to multi-robot precision systems, including the NeXus microassembly platform, bridging the gap between microscale fabrication and industrial automation. Collectively, his portfolio of over 125 citations reflects a researcher at the productive intersection of smart materials, micro-scale locomotion, and human-robot collaboration.

Research Focus

Key Achievements

8
H-Index
21
Papers
174
Total Citations
8
Avg Citations/Paper
🏆 Most Cited Paper
Fabrication of strain gauge based sensors for tactile skins
20 citations · 2017
📈 Most Prolific Year: 2022 (7 Papers)
🤝 Key Collaborators: 32
🏛 Institutions: University of Louisville, University of Louisville Hospital, Robotics Research (United States)

Top Papers

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Key Collaborators

Contact & Links

Available for collaboration
Content generated · 14 days ago