Phil Seidel
Papers
2
Total Citations
9
H-Index
2
About
Phil Seidel has been a key figure in advancing the infrastructure for extreme ultraviolet lithography (EUV), a critical technology for next-generation semiconductor manufacturing. His research has focused on the practical challenges of EUV reticle handling and protection, particularly the development of standardized solutions to replace conventional pellicles, which are incompatible with EUV wavelengths. Seidel’s most-cited works, including “Status of EUV reticle handling solution in meeting 32 nm HP EUV lithography” (2008, 5 citations) and “Status and path to a final EUVL reticle-handling solution” (2007, 4 citations), document the industry’s convergence on the dual pod reticle carrier approach. These contributions have been instrumental in defining protocols for reticle shipping, robotic handling, in-fab transport, and storage, ensuring the cleanliness and integrity of masks in high-volume manufacturing. While his citation counts reflect a specialized field, Seidel’s work has provided foundational guidance for engineers and researchers tackling the unique material and operational constraints of EUV lithography. His efforts have helped pave the way for the 32 nm half-pitch node and beyond, making him a respected voice in the EUV mask ecosystem.
Research Focus
Key Achievements
Top Papers
- 1
- 2Status and path to a final EUVL reticle-handling solution4 citations · 2007