Hung Pang Lee

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About

Hung Pang Lee is pioneering the development of next-generation electronic skin (E-skin) through advanced 3D printing and nanoengineering. His research focuses on creating flexible, stretchable materials that mimic human skin’s sensitivity to strain, pressure, and temperature—critical for applications in robotics, wearable technology, and healthcare. Lee’s most influential work, a 2024 paper in *Advanced Functional Materials* on “3D Printed Electronic Skin for Strain, Pressure and Temperature Sensing,” has already garnered 86 citations, underscoring its immediate impact. This study demonstrates how nanoengineered materials enable multifunctional sensing, paving the way for more intuitive human–machine interfaces and durable prosthetics. A related publication in the same journal further highlights the scalability of 3D printing for E-skin fabrication. Lee’s contributions are reshaping how we integrate soft electronics into daily life, bridging the gap between rigid devices and biological tissue. His work not only advances materials science but also holds promise for revolutionizing robotics and patient monitoring. For students and researchers, Lee’s research exemplifies how interdisciplinary approaches—combining materials engineering, nanotechnology, and additive manufacturing—can solve real-world challenges in sensing and interaction.