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Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

31 次引用 · 2012

📈 最高产年份: 2012 (6 论文)

🤝 主要合作者: 29

🏛 所属机构: Tohoku University, ON Semiconductor (United States), Tohoku University Hospital

代表论文

1
Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection
31 次引用 · 2012
2
Revolution of Sensors in Micro-Electromechanical Systems
28 次引用 · 2012
3
Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin
25 次引用 · 2018
4
MEMS development focusing on collaboration using common facilities: a retrospective view and future directions
19 次引用 · 2021
5
Revolution of Sensors in Micro-Electromechanical Systems
16 次引用 · 2012
6
Fabrication of semiconductor tactile imager
11 次引用 · 1990
7
Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots
10 次引用 · 2011
8
LSI Design for Sensing Data Transmission by Interruption in Tactile Sensor Systems
9 次引用 · 2009
9
Tactile sensor network system with CMOS-MEMS integration for social robot applications
9 次引用 · 2014
10
Fabrication and characterization of a silicon capacitive structure for simultaneous detection of acceleration and angular rate
6 次引用 · 1996

Masayoshi Esashi

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