OTHER
Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection
Mitsutoshi Makihata, Shuji Tanaka, Masanori Muroyama, Sakae Matsuzaki, Hiroyuki YAMADA, Takahiro Nakayama, Ui Yamaguchi, Kazuhiro Mima, Yutaka Nonomura, Motohiro Fujiyoshi, Masayoshi Esashi
- 发表年份
- 2012
- 引用次数
- 31
关键词
Wafer dicingMaterials scienceWaferOptoelectronicsCapacitive sensingTactile sensorCapacitanceCMOSMicroelectromechanical systemsSurface micromachining
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