Yigit Mahsereci
Institut für Mikroelektronik Stuttgart, University of Stuttgart
Papers
5
Total Citations
90
H-Index
5
About
Yigit Mahsereci is a pioneer in the emerging field of **flexible electronics**, with a specific focus on **Hybrid Systems-in-Foil (HySiF)** technology. His research seamlessly integrates three distinct flexible electronics technologies—ultra-thin silicon chips, organic electronics, and printed components—onto a single polymer substrate. His most significant contribution is the development of an **ultra-thin (20 μm) flexible CMOS stress sensor**, which he successfully demonstrated on an adaptive Fin Ray® robotic gripper. This sensor enables robots to "feel" by measuring in-plane stress, allowing for the extraction of object shape and operational status. Mahsereci’s work on a **smart electronic skin** (32 citations) represents a landmark achievement, combining high-performance circuit integration with large-area, flexible components. His designs for CMOS readout circuits on ultra-thin chips have been crucial for precise sensor data acquisition in wearable and robotic applications. By bridging rigid high-performance electronics with flexible, large-area systems, Mahsereci has laid the foundational engineering for next-generation **wearable electronics, medical diagnostics, and adaptive robotics**.
Research Focus
Key Achievements
Top Papers
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