Joachim N. Burghartz
Papers
5
Total Citations
90
H-Index
5
About
Joachim N. Burghartz is a pioneer in flexible electronics, specializing in ultra-thin silicon chips and hybrid system-in-foil (HySiF) technology. His research integrates high-performance CMOS circuits with flexible substrates, enabling novel applications in robotics, wearables, and biomedical devices. Burghartz’s most cited work introduces a smart electronic skin that combines three flexible electronics technologies—ultra-thin CMOS chips, organic electronics, and printed components—on a single polymer foil. This HySiF concept allows sensors to bend, stretch, and conform to irregular surfaces, a breakthrough for adaptive robotic grippers and prosthetics. His 2015 paper on a 20 μm flexible CMOS stress sensor, demonstrated on a Fin Ray® gripper, shows how in-plane stress measurements can extract object shape and operation status, with 26 citations. Another key contribution is the design of a CMOS readout circuit for printed strain gauges, enabling precise sensor signal processing on flexible chips. With over 90 publications and numerous patents, Burghartz has shaped the field of flexible hybrid electronics, bridging the gap between rigid silicon performance and mechanical flexibility. His work continues to inspire next-generation smart skins, wearable health monitors, and large-area sensing systems.
Research Focus
Key Achievements
Top Papers
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