Simon J. Bleiker
Papers
1
Total Citations
38
H-Index
1
About
Simon J. Bleiker is a leading researcher in advanced microsystems packaging, with a primary focus on through-glass via (TGV) technology for glass interposers and MEMS packaging. His most-cited work, "Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires" (2018, 38 citations), addresses a critical challenge in the field: creating reliable vertical electrical connections through glass substrates. Bleiker’s major contribution lies in developing a novel magnetic assembly method for microscale metal wires, enabling the fabrication of TGVs without the need for conventional, costly via drilling and metallization processes. This innovation has significant implications for high-performance packaging in consumer electronics, RF devices, and MEMS sensors, where glass offers superior electrical insulation and thermal stability. With 38 citations, his work is recognized as a foundational step toward scalable, cost-effective glass interposer manufacturing. Bleiker’s research continues to push boundaries in heterogeneous integration, making him a key figure in the evolution of next-generation electronic packaging solutions.
Research Focus
Key Achievements
Top Papers
- 1