Interposer

High Performance, High Density RDL for Advanced Packaging

Chengpu Yu, Luo‐Ting Yen, C. Y. Hsieh, Jeng-Sheng Hsieh, Victor C. Y. Chang, C.H. Hsieh, C. S. Liu, C. T. Wang, KC Yee, Doug C. H. Yu

Citations: 43 • 2018

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf Mårtensson, Mikhail Asiatici, Andreas Fischer, Göran Stemme, Thorbjörn Ebefors, Frank Niklaus

Citations: 38 • 2018

Electrical Performances of Fan-Out Embedded Bridge

JinWei You, Jay Li, David Ho, Jackson Li, Ming Han Zhuang, David Lai, C. Key Chung, Yu-Po Wang

Citations: 19 • 2021

Flip chip equipment for high end electro-optical modules

Keith A. Cooper, Ruimin Yang, Jean-Stephane Mottet, Gilbert Lecarpentier

Citations: 7 • 2002

Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application

Tsun-Lung Hsieh, Hung‐Chun Kuo, Ming-Fong Jhong, Chih-Yi Huang, Chen-Chao Wang

Citations: 4 • 2019