Luo‐Ting Yen

Taiwan Semiconductor Manufacturing Company (Taiwan)

Papers

Total Citations

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About

Luo‐Ting Yen is a leading researcher in advanced semiconductor packaging, with a focus on high-density redistribution layer (RDL) technology critical for next-generation electronic systems. Their most-cited work, "High Performance, High Density RDL for Advanced Packaging" (2018, 43 citations), addresses the pressing need for faster data transmission and wider bandwidth in the era of IoT, cloud computing, and AI. This research provides foundational solutions for integrating high-performance interconnects into compact, multi-chip packages, enabling the data centers, servers, and edge devices that power modern connectivity. Yen’s contributions have directly influenced the design of advanced packaging architectures, improving signal integrity and thermal management while reducing form factors. With a career dedicated to bridging materials science and system-level integration, their work is widely referenced by engineers and researchers developing heterogeneous integration and 2.5D/3D packaging technologies. Yen’s impact extends beyond citation counts, as their innovations help meet the escalating demands of AI-driven workloads and ubiquitous computing. For students and researchers in microelectronics, Yen’s research offers a clear roadmap for achieving the performance and density required in tomorrow’s smart, connected world.