Jeng-Sheng Hsieh

Taiwan Semiconductor Manufacturing Company (Taiwan)

Papers

Total Citations

H-Index

About

Jeng-Sheng Hsieh is a leading expert in advanced semiconductor packaging, with a primary focus on redistribution layer (RDL) technology for high-performance, high-density interconnects. His most-cited work, the 2018 paper "High Performance, High Density RDL for Advanced Packaging" (43 citations), addresses a critical bottleneck in the Internet of Things (IoT) era: the need for faster data transmission and wider bandwidth to support cloud computing, data centers, servers, AI, and edge devices. Hsieh’s contributions lie in developing RDL solutions that enable finer line widths and spaces, reducing signal loss and improving electrical performance—key for heterogeneous integration and 2.5D/3D packaging. His research directly impacts the scalability of next-generation electronics, bridging the gap between chip-level performance and system-level demands. With a citation count reflecting the relevance of his work to both academia and industry, Hsieh is recognized for pushing the limits of packaging density and reliability. His achievements underscore a career dedicated to enabling the physical infrastructure of modern computing, from massive data centers to compact edge devices, making him a pivotal figure in the evolution of high-performance electronics.