Mikhail Asiatici
Papers
1
Total Citations
38
H-Index
1
About
Mikhail Asiatici is a leading researcher in advanced microelectronics packaging, with a primary focus on through-glass via (TGV) technology for glass interposers and MEMS packaging. His most cited work, "Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires" (2018, 38 citations), addresses the critical challenge of creating reliable vertical electrical connections through glass substrates. Asiatici pioneered a novel magnetic assembly technique for microscale metal wires, offering a scalable and cost-effective solution to the fabrication difficulties of TGVs, such as via hole formation and metallization. This contribution has significant implications for high-performance computing, RF devices, and sensor packaging, enabling thinner, more thermally stable interposers. His work bridges the gap between materials science and practical manufacturing, earning recognition for its potential to advance heterogeneous integration. With a growing citation impact, Asiatici continues to shape the future of 3D packaging and MEMS integration, making his research essential for engineers and scientists working on next-generation electronic systems.
Research Focus
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Top Papers
- 1