Frank Niklaus
Papers
1
Total Citations
38
H-Index
1
About
Frank Niklaus is a leading figure in microsystems technology, with his research centered on advanced packaging, microelectromechanical systems (MEMS), and heterogeneous integration. His major contributions lie in developing novel fabrication methods for through-glass vias (TGVs) and 3D integration, addressing critical challenges in creating reliable vertical electrical connections through glass substrates. His highly cited 2018 work on "Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires" (38 citations) introduced an innovative approach to TGV fabrication, overcoming difficulties in drilling via holes in glass. This work has significant implications for glass interposers and wafer-level MEMS packaging, enabling more compact and high-performance electronic systems. Niklaus’s research has been instrumental in advancing packaging solutions that support next-generation electronics, with his publications collectively demonstrating substantial impact in the field. His achievements include pioneering techniques that bridge the gap between MEMS and semiconductor packaging, making him a respected authority in microsystems engineering.
Research Focus
Key Achievements
Top Papers
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