Masayoshi Esashi
Tohoku University, ON Semiconductor (United States), Tohoku University Hospital
Papers
16
Total Citations
184
H-Index
9
About
Masayoshi Esashi is a pioneering figure in microelectromechanical systems (MEMS) research, with decades of transformative contributions spanning sensor design, fabrication technology, and robotics applications. His work has fundamentally shaped how MEMS devices are conceived, built, and deployed, particularly in the domains of tactile sensing and microsensor integration. Esashi is perhaps best recognized for his sustained efforts in developing tactile sensor systems for robotic applications. From early foundational work on semiconductor tactile imagers in 1990 to sophisticated network-based whole-body robot skin systems in 2018, he has consistently pushed the boundaries of pressure sensing density, packaging efficiency, and digital communication. His integration of MEMS with CMOS technology — including innovations using BCB isolation layers and backside-grooved electrical connections — reflects a deep commitment to practical, manufacturable solutions. Beyond tactile sensing, Esashi has made notable contributions to pressure sensors, SAW wireless sensors, and inertial measurement devices, as reviewed in his widely cited work on the revolution of MEMS-based microsensors. His collaborative model of MEMS development through shared fabrication facilities has also influenced how academic-industry partnerships operate. With cumulative citations exceeding 160 across his most recognized works, Esashi's legacy is one of enduring technical innovation and community-building in MEMS research.
Research Focus
Key Achievements
Top Papers
- 1
- 2Revolution of Sensors in Micro-Electromechanical Systems28 citations · 2012
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- 5Revolution of Sensors in Micro-Electromechanical Systems16 citations · 2012
- 6Fabrication of semiconductor tactile imager11 citations · 1990
- 7Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots10 citations · 2011
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- 10