Necdet Geren

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代表论文

1. 1
   The significance of desoldering and resoldering methods in robotic automated rework

   12 次引用 · 1994
2. 2
   Automated rework of printed circuit board assemblies: Methods and procedures

   11 次引用 · 1996
3. 3
   Solder Paste Dispensing in Robotic SMD Rework

   7 次引用 · 1994
4. 4
   Cost and performance analysis of a robotic rework cell

   7 次引用 · 1999
5. 5
   Design of a flexible assembly and remanufacturing cell for advanced SM components: selection of cell design concept based on reflow tools

   5 次引用 · 2006
6. 6
   Computer‐Integrated Automatic PCBA Rework

   5 次引用 · 1992
7. 7
   Software architecture of a printed circuit board assembly (PCBA) robotic rework cell

   4 次引用 · 1997
8. 8
   Automated removal and replacement of surface mounted devices in electronic assembly

   4 次引用 · 1997
9. 9
   Automated removal and replacement of through-hole components in robotic rework

   3 次引用 · 1997
10. 10
    Determination and comparison of surface mount component rework cycle times of manual and fully automated robotic rework stations for rework technology selection

    3 次引用 · 2003

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