Development of Automatic Wafer Centering System for Vacuum Transfer Robot Using for Semiconductor Manufacturing

摘要

The automatic wafer centering system having the function as wafer slip is measured and arm is controlled to compensate the wafer position error by slip is proposed. Two dimensional positions to compensate the wafer slip from measured sensor signal are calculated by using the compensation algorithm. Automatic wafer centering system is developed and verification test is conducted. In the verification test, developed automatic wafer centering system has measurement accuracy of under 0.2mm for radial and tangential direction.