Yuki Honda
Papers
2
Total Citations
13
H-Index
2
About
Yuki Honda is a leading innovator in advanced semiconductor imaging, whose work is redefining the limits of CMOS image sensor architecture. His primary research focuses on three-dimensional integrated circuit (3D-IC) design and heterogeneous integration, specifically targeting the development of pixel-parallel, multi-layer stacked sensors. Honda’s major contribution is the pioneering demonstration of the world’s first three-layer stacked pixel-parallel CMOS image sensors. By ingeniously employing double-sided hybrid bonding of silicon-on-insulator (SOI) wafers—embedding damascened Au electrodes in SiO2—he enabled both face-to-face and face-to-back bonding. This breakthrough overcomes traditional interconnect bottlenecks, allowing for unprecedented pixel-level parallelism and dramatically improved processing speed. His foundational 2023 study, which has garnered 9 citations, and its 2022 precursor, with 4 citations, are already shaping the future of high-performance imaging. This novel stacking architecture is a critical enabler for next-generation applications in high-speed machine vision, augmented reality, and advanced scientific imaging, establishing Honda as a key figure in pushing the frontiers of 3D-stacked sensor technology.
Research Focus
Key Achievements
Top Papers
- 1
- 2