Masakazu Nanba
Papers
2
Total Citations
13
H-Index
2
About
Masakazu Nanba is a leading figure in advanced semiconductor imaging, whose pioneering work has pushed the boundaries of stacked CMOS image sensor technology. His primary research focus lies in the development of multi-layer, pixel-parallel architectures, where he has achieved landmark firsts in the field. Nanba’s most significant contribution is the world’s first demonstration of a three-layer stacked pixel-parallel CMOS image sensor, a breakthrough that dramatically increases processing power and functionality at the pixel level. This was accomplished through an innovative method of double-sided hybrid bonding of silicon-on-insulator (SOI) wafers, using damascened Au electrodes embedded in SiO₂ to enable both face-to-face and face-to-back bonding. His 2023 paper on this topic, which has already garnered 9 citations, along with his foundational 2022 work (4 citations), establishes him as a key innovator in overcoming the critical interconnect challenges of 3D integration. By enabling denser, faster, and more intelligent image sensors, Nanba’s research is paving the way for next-generation applications in high-speed machine vision, augmented reality, and advanced computational photography.
Research Focus
Key Achievements
Top Papers
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- 2