Sachiko Ogawa

Doshisha University, College of Industrial Technology

Papers

Total Citations

H-Index

About

Sachiko Ogawa is a researcher advancing sustainable manufacturing through precision polishing technologies. Her primary research areas include eco-friendly fixed-abrasive polishing, compact robotics for material processing, and sustainable manufacturing processes. Ogawa’s major contribution lies in developing a novel fixed-abrasive polishing method using compact robots, which significantly reduces environmental impact compared to traditional slurry-based techniques. Her 2010 study, “Investigation of Eco-Friendly Fixed-Abrasive Polishing with Compact Robot” (6 citations), introduced the innovative concept of secondary tools and demonstrated the effectiveness of compact robots through life cycle analysis. Building on this, her 2012 work, “Influence of Polishing and Pressing Force on the Material Removal Rate in Fixed Abrasive Polishing with Compact Robot” (5 citations), systematically investigated how polishing pressure and pressing force affect material removal rates using a five-joint closed-link compact robot with a fine diamond stone for glass plate polishing. Although her citation counts are modest, Ogawa’s work represents an important step toward environmentally responsible manufacturing, addressing the growing demand for sustainable development in industrial processes. Her research offers practical insights for engineers and researchers seeking to minimize ecological footprints while maintaining precision in material finishing applications.