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About

Dr. Renheng Bo is a leading researcher in the mechanics of architected materials and flexible electronics, with a focus on mechanically-guided 3D assembly, bioinspired composites, and shape-morphing systems. His most impactful work, a 2023 study on mechanically-guided 3D assembly for architected flexible electronics (139 citations), has provided foundational principles for designing 3D geometries that enable applications in biomedical devices, soft robotics, and wearable sensors. Dr. Bo has also made significant contributions to the durability of flexible electronics through an anti-fatigue design strategy for 3D ribbon-shaped structures (47 citations), and to impact-resistant materials by developing bioinspired solid-liquid lattice designs (32 citations) that mimic the durian peel’s rate-dependent stiffness. His recent work on thin-film-shaped flexible actuators (26 citations) and transforming machines capable of continuous 3D shape morphing and locking (20 citations) demonstrates his ongoing innovation in creating adaptive, multifunctional systems. With a portfolio of highly cited papers and emerging work on shear-guided morphable architectures and magnetic soft robots, Dr. Bo is advancing the frontier of flexible, reconfigurable devices for next-generation engineering and healthcare.