Mengqi Cui

TU Dresden

Papers

1

Total Citations

7

H-Index

1

About

Mengqi Cui is a rising leader in millimeter-wave integrated circuit design, with a focus on enabling the next generation of ultra-low-power, high-speed wireless communication for Tactile Internet applications. Her most cited work, published in 2024, introduces the first power and speed adaptive 60 GHz receiver, fabricated in advanced 22 nm FD-SOI CMOS technology. This pioneering design dynamically balances high data rates with minimal energy consumption, a critical breakthrough for emerging haptic and robotic systems—such as compact wireless robotic skins—that demand both responsiveness and energy efficiency. With 7 citations already, this paper marks a significant contribution to adaptive RF front-end architectures. Cui’s research elegantly bridges the gap between cutting-edge semiconductor technology and real-world tactile feedback systems, demonstrating how intelligent circuit-level adaptation can unlock new possibilities in immersive human-machine interaction. Her work promises to shape the future of low-latency, high-bandwidth wireless links essential for remote surgery, virtual reality, and industrial automation.

Research Focus

Key Achievements

1
H-Index
1
Papers
7
Total Citations
7
Avg Citations/Paper
🏆 Most Cited Paper
Designing a Power and Speed Adaptive 60 GHz Receiver in 22 nm FD-SOI CMOS for Tactile Internet Applications
7 citations · 2024
📈 Most Prolific Year: 2024 (1 Papers)
🤝 Key Collaborators: 6
🏛 Institutions: TU Dresden

Top Papers

  1. 1

Key Collaborators

Contact & Links

Available for collaboration
Content generated · 12 days ago