Bin Fei

Hong Kong Polytechnic University

Papers

2

Total Citations

269

H-Index

2

About

Bin Fei is a leading figure in flexible electronics and wearable bio-sensing, whose work bridges materials science and biomedical engineering. His research centers on developing advanced electronic skins (e-skins) and stretchable strain sensors that mimic biological functions for real-time health monitoring and human-machine interfaces. Fei’s major contributions include the design of a bioinspired all-fibrous e-skin with directional moisture-wicking properties, enabling both biomechanical energy harvesting and all-range health sensing—a breakthrough cited over 180 times. He also engineered a high-linearity, low-hysteresis self-healing strain sensor using Ti₃C₂Tₓ MXene, silver nanowires, and liquid metal, modulated by dynamic disulfide and hydrogen bonds, achieving 88 citations. This sensor addresses critical challenges in interface stability and signal fidelity under deformation. Fei’s work has been recognized for its potential in soft robotics and alternative diagnostics, with his papers collectively garnering hundreds of citations. His innovative approach to integrating self-healing, moisture management, and linear response in flexible devices marks him as a key innovator in next-generation wearable technology.

Research Focus

Key Achievements

2
H-Index
2
Papers
269
Total Citations
135
Avg Citations/Paper
🏆 Most Cited Paper
Bioinspired All-Fibrous Directional Moisture-Wicking Electronic Skins for Biomechanical Energy Harvesting and All-Range Health Sensing
181 citations · 2023
📈 Most Prolific Year: 2023 (2 Papers)
🤝 Key Collaborators: 18
🏛 Institutions: Hong Kong Polytechnic University

Top Papers

  1. 1
  2. 2

Key Collaborators

Contact & Links

Available for collaboration
Content generated · 13 days ago