H. Hashiguchi
Papers
1
Total Citations
26
H-Index
1
About
H. Hashiguchi is a leading figure in advanced semiconductor packaging and three-dimensional (3D) integration, with a career focused on overcoming the fundamental scaling challenges of modern microelectronics. His most influential work introduces a groundbreaking chip-to-wafer 3D integration technology that ingeniously combines hybrid self-assembly with electrostatic temporary bonding. This approach, detailed in his highly cited 2012 paper (26 citations), merges the precision of liquid surface-tension-driven self-assembly with the speed of robotic pick-and-place, solving a critical bottleneck in high-throughput, high-accuracy chip stacking. By enabling finer pitch interconnections and reducing process complexity, Hashiguchi’s innovations directly address the industry’s demand for denser, more powerful, and energy-efficient systems. His contributions have been instrumental in advancing heterogeneous integration, where disparate components—such as logic, memory, and sensors—are combined into a single package. Through this seminal work, Hashiguchi has established himself as a key innovator in 3D integration, providing a practical pathway for next-generation electronics that power everything from high-performance computing to compact mobile devices.
Research Focus
Key Achievements
Top Papers
- 1