Direct bonding

Top Researchers

Takafumi Fukushima

Institution: —

H. Hashiguchi

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J. C. Bea

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Yuki Ohara

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M. Murugesan

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K.-W. Lee

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Tetsu Tanaka

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Mitsumasa Koyanagi

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Ramses Günther

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Giuseppe Vacanti

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New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding

Takafumi Fukushima, H. Hashiguchi, J. C. Bea, Yuki Ohara, M. Murugesan, K.-W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Citations: 26 • 2012

Direct Bonding of Multiple Curved, Wedged and Structured Silicon Wafers as X-Ray Mirrors

Boris Landgraf, Ramses Günther, Giuseppe Vacanti, Nicolas M. Barrière, Mark Vervest, David Girou, Alex Yanson, Max Collon

Citations: 2 • 2016