Mitsumasa Koyanagi

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About

Mitsumasa Koyanagi is a pioneering figure in three-dimensional (3D) integration technology and advanced semiconductor packaging. His key research areas include 3D chip stacking, heterogeneous integration, and high-speed vision systems for robotics. Among his most notable contributions is the development of a novel chip-to-wafer 3D integration technology that combines hybrid self-assembly with electrostatic temporary bonding, a breakthrough that enables precise, high-throughput stacking of thin chips for next-generation electronics. This work, published in 2012 and cited 26 times, addresses critical challenges in manufacturing dense, high-performance 3D integrated circuits. Earlier, Koyanagi contributed to robotics by designing a high-speed vision system capable of human-like eye movements and rapid image processing, leveraging a binocular camera head and high-speed image sensors. This system, cited 10 times, was tailored for intelligent mobile robots and neuromorphic vision chips. His interdisciplinary approach—bridging semiconductor fabrication, packaging, and robotics—has made a lasting impact on both industrial manufacturing and autonomous systems. Koyanagi’s work continues to inspire researchers in 3D integration and machine vision, demonstrating how fundamental engineering advances can enable transformative technologies.