Mitsumasa Koyanagi

Tohoku University

Papers

2

Total Citations

36

H-Index

2

About

No biography available yet.

Research Focus

Chip2 · 36 citations
Wafer bonding1 · 26 citations
Direct bonding1 · 26 citations
Electrical engineering1 · 26 citations
Engineering1 · 26 citations
Integrated circuit1 · 26 citations
Materials science1 · 26 citations
Nanotechnology1 · 26 citations
Optoelectronics1 · 26 citations
Surface tension1 · 26 citations
Three-dimensional integrated circuit1 · 26 citations
Wafer1 · 26 citations

Key Achievements

2
H-Index
2
Papers
36
Total Citations
18
Avg Citations/Paper
🏆 Most Cited Paper
New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding
26 citations · 2012
📈 Most Prolific Year: 2012 (1 Papers)
🤝 Key Collaborators: 14
🏛 Institutions: Tohoku University

Top Papers

  1. 1
    New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding
    26 citations · 2012
  2. 2
    Development of a High Speed Vision System for Mobile Robots
    10 citations · 2006

Key Collaborators

TSTakeaki Sugimura1 shared papersTTTetsu Tanaka1 shared papersRURyo Uchikura1 shared papersTIToshiyuki Ishihara1 shared papersHHH. Hashiguchi1 shared papersTFTakafumi Fukushima1 shared papersTTTeppei Tsujita1 shared papersMMM. Murugesan1 shared papersAKAtsushi Konno1 shared papersYOYuki Ohara1 shared papersKLK.-W. Lee1 shared papersJCJ. C. Bea1 shared papersMUMasaru Uchiyama1 shared papersJDJun Deguchi1 shared papers
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