Chih-Chung Hsu

About

Dr. Chih-Chung Hsu is a materials scientist specializing in the characterization and application of polymer-based encapsulation materials for advanced semiconductor packaging. His research focuses on the pressure-volume-temperature-cure (P-V-T-C) property characterization of epoxy molding compounds (EMCs), a critical area for ensuring reliability in high-performance IC chips used in IoT, automation, and Industry 4.0 technologies. Dr. Hsu’s most cited work, "Investigation on the P-V-T-C property characterization and its importance on IC encapsulation material application" (2019), provides foundational insights into how curing kinetics and thermomechanical behavior affect package warpage and stress. This contribution has been cited 6 times, establishing a framework for optimizing chemical-cured materials in microelectronics. His achievements include advancing the understanding of process-structure-property relationships in encapsulation, directly impacting the design of more reliable, miniaturized electronic components. Dr. Hsu’s work bridges fundamental materials science with practical industrial challenges, making him a key figure in the development of next-generation packaging solutions for the smart electronics era.

Research Focus

Key Achievements

Top Papers

1. 1
   Investigation on the P-V-T-C property characterization and its importance on IC encapsulation material application

   6 citations · 2019

Key Collaborators

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