Chen-Chieh Wang
Papers
1
Total Citations
6
H-Index
1
About
Dr. Chen-Chieh Wang is a leading researcher in the field of microelectronics packaging and materials science, with a focused expertise in the characterization and application of epoxy molding compounds (EMCs) for integrated circuits. His most influential work, "Investigation on the P-V-T-C property characterization and its importance on IC encapsulation material application," has garnered significant attention, accumulating 6 citations since its 2019 publication. This foundational study addresses a critical challenge in the semiconductor industry: the need for precise pressure-volume-temperature-cure (P-V-T-C) data to optimize encapsulation processes for high-performance chips used in IoT, automation, and Industry 4.0 technologies. Dr. Wang’s contributions provide essential insights into material behavior during curing, enabling more reliable and efficient packaging solutions that meet increasingly stringent specifications. His research bridges the gap between material chemistry and industrial application, offering practical methodologies for characterizing chemical-cured materials. By advancing the understanding of how EMCs respond to thermal and mechanical stresses, Dr. Wang has helped improve the durability and performance of modern electronic components. His work remains a valuable resource for engineers and researchers seeking to enhance IC reliability in demanding environments.
Research Focus
Key Achievements
Top Papers
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