Wafer bonding

Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

Mitsutoshi Makihata, Shuji Tanaka, Masanori Muroyama, Sakae Matsuzaki, Hiroyuki YAMADA, Takahiro Nakayama, Ui Yamaguchi, Kazuhiro Mima, Yutaka Nonomura, Motohiro Fujiyoshi, Masayoshi Esashi

引用数: 31 • 2012

New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding

Takafumi Fukushima, H. Hashiguchi, J. C. Bea, Yuki Ohara, M. Murugesan, K.-W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi

引用数: 26 • 2012

A new wafer-bonder of ultra-high precision using surface activated bonding (SAB) concept

Tadatomo Suga, M.M.R. Howlader, Toshihiro Itoh, C. Inaka, Yoshikazu Arai, Akira Yamauchi

引用数: 16 • 2002

3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers

Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto

引用数: 4 • 2022

Direct Bonding of Multiple Curved, Wedged and Structured Silicon Wafers as X-Ray Mirrors

Boris Landgraf, Ramses Günther, Giuseppe Vacanti, Nicolas M. Barrière, Mark Vervest, David Girou, Alex Yanson, Max Collon

引用数: 2 • 2016