Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation

摘要

Due to their vast number of benefits, plenty of complex and miniaturized three dimensional molded interconnect devices are developed. One especially demanding process step during their manufacturing is the geometrical exact creation of the conductive pattern layout on the different substrates’ faces. Therefore, sophisticated and flexible technologies like laser direct structuring or printing processes can be used, which are subject to multiple research activities, concentrating for example on coating materials or process parameters. An additional aspect is the necessity of providing a flexible and sufficiently accurate handling device, which three dimensionally moves the substrate relative to the process nozzle applying the coating material. For this task industrial robots could be used, which inherit multiple beneficial features. One main drawback of using this type of kinematic is their relative low absolute accuracy of a few hundred microns, which is not sufficient for moving the substrate during the process with the needed accuracy.