Zepeng Lei

University of Colorado Boulder

Papers

2

Total Citations

238

H-Index

2

About

Zepeng Lei is pioneering the future of wearable electronics through innovative materials design that bridges the gap between rigid, soft, and liquid components. His landmark 2020 work on heterogeneous integration for self-healable, recyclable, and reconfigurable wearable systems has garnered 199 citations, establishing a new paradigm for electronics that can adapt, repair themselves, and be sustainably repurposed. Lei’s research addresses fundamental challenges in stretchable electronics, particularly in creating devices that maintain functionality under mechanical deformation while offering unprecedented lifecycle sustainability. His 2021 development of stretchable, rehealable, and recyclable integrated strain sensors for joint motion and respiration monitoring (39 citations) demonstrates practical applications in health monitoring and human-computer interfaces. By combining advances in materials chemistry with mechanical engineering, Lei has created wearable systems that not only perform with high sensitivity but can be fully recycled and reconfigured into new devices—a critical step toward reducing electronic waste. His work is shaping the next generation of skin-mountable electronics for virtual reality, healthcare, and interactive technologies, where durability, adaptability, and environmental responsibility converge.

Research Focus

Key Achievements

2
H-Index
2
Papers
238
Total Citations
119
Avg Citations/Paper
🏆 Most Cited Paper
Heterogeneous integration of rigid, soft, and liquid materials for self-healable, recyclable, and reconfigurable wearable electronics
199 citations · 2020
📈 Most Prolific Year: 2020 (1 Papers)
🤝 Key Collaborators: 6
🏛 Institutions: University of Colorado Boulder

Top Papers

  1. 1
  2. 2

Key Collaborators

Contact & Links

Available for collaboration
Content generated · 13 days ago