Xiang‐Sen Meng

University of Science and Technology of China

Papers

Total Citations

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About

Xiang-Sen Meng is a rising innovator in flexible electronics, with a focus on electronic skin (e-skin) technologies and their applications in soft robotics and structural health monitoring. His most-cited work, "Unique nanowire assemblies enables superior anti-interference capability for accurate structural failure prediction and soft robotics" (2024, 6 citations), introduces a breakthrough in anisotropic e-skins that can perceive multiple external stimuli with exceptional precision. Meng’s key contribution lies in engineering nanowire assemblies that grant e-skins superior anti-interference capabilities, enabling accurate prediction of structural failures—a critical advancement for safety in aerospace and civil engineering. This work also expands the utility of e-skins in soft robotics, where reliable sensing under complex conditions is essential. By addressing the challenge of signal interference in flexible sensors, Meng has paved the way for more robust and intelligent wearable systems. His research bridges materials science and practical engineering, offering solutions that enhance the reliability of next-generation prosthetics and healthcare monitors. With growing citation impact, Meng is establishing himself as a key contributor to the future of adaptive, sensor-rich environments.