Seiichi Takamatsu

Binghamton University, The University of Tokyo

Papers

2

Total Citations

4

H-Index

2

About

No biography available yet.

Research Focus

Silicon2 · 4 citations
Bending2 · 4 citations
Decoupling (probability)1 · 2 citations
Durability1 · 2 citations
Electronic engineering1 · 2 citations
Engineering1 · 2 citations
Flexibility (engineering)1 · 2 citations
Flexible electronics1 · 2 citations
Integrated circuit1 · 2 citations
Integrated circuit packaging1 · 2 citations
Materials science1 · 2 citations
Optoelectronics1 · 2 citations

Key Achievements

2
H-Index
2
Papers
4
Total Citations
2
Avg Citations/Paper
🏆 Most Cited Paper
A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics
2 citations · 2026
📈 Most Prolific Year: 2026 (1 Papers)
🤝 Key Collaborators: 9
🏛 Institutions: Binghamton University, The University of Tokyo

Top Papers

  1. 1
    A Strain Decoupling Packaging Strategy for High‐Fidelity Ultrathin Silicon Shape Sensors for Soft Medical Robotics
    2 citations · 2026
  2. 2
    Flexible Stretch-Free, Liquid-Sealed Packaging Method for Ultra-Thin Silicon-Based Bending Sensor
    2 citations · 2024

Key Collaborators

MYMichitaka Yamamoto2 shared papersHLHao Liu1 shared papersTSTakao Someya1 shared papersHLHao Liu1 shared papersTYTomoyuki Yokota1 shared papersTIToshihiro Itoh1 shared papersYWYue Wang1 shared papersTIToshihiro Itoh1 shared papersMTMasahito Takakuwa1 shared papers
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