Rakesh Chand
Papers
2
Total Citations
35
H-Index
2
About
Rakesh Chand is a researcher at the forefront of MEMS-based tactile sensing technology, with a focused expertise in the design and integration of microelectromechanical systems (MEMS) with platform LSI (Large-Scale Integration) for robotic applications. His major contributions center on the development of highly sensitive, surface-mountable 3-axis tactile sensors that can measure normal and shear forces simultaneously. Chand’s most-cited work, “Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias” (2018, 31 citations), introduces a novel quad-seesaw-electrode architecture that enables fully-differential capacitive sensing, significantly improving signal-to-noise ratio and accuracy. His subsequent paper (2017, 4 citations) further advances this concept by demonstrating a fully-integrated, 2.8-mm-square sensor that combines MEMS and CMOS circuitry on a single chip using through-silicon vias (TSVs) for compact, surface-mountable packaging. This work is particularly notable for its potential to equip robots with precise tactile feedback, enhancing dexterous manipulation and human-robot interaction. Chand’s research has laid critical groundwork for next-generation tactile sensors, offering a scalable, high-performance solution for robotics and haptic interfaces.
Research Focus
Key Achievements
Top Papers
- 1
- 2