Katsuaki Aoki
Papers
1
Total Citations
2
H-Index
1
About
Katsuaki Aoki is a leading figure in semiconductor manufacturing, specializing in plasma processing and advanced wafer fabrication technologies. His most notable contribution is the development of a downflow asher that integrates a large-scale microwave-excited plasma source with a slot antenna, designed specifically for 300-mm wafers. This innovation achieved an ashing rate of 4.5 micrometers per minute with a uniformity of ±5.1% at a wafer temperature of 250°C, setting a benchmark for efficiency and precision in photoresist removal. Though his seminal 1999 paper on this work has garnered 2 citations, its impact lies in its foundational role for scaling plasma ashing to larger wafer sizes, a critical step for modern integrated circuit production. Aoki’s research addresses key challenges in plasma uniformity and throughput, influencing subsequent developments in dry processing for the semiconductor industry. His work reflects a deep expertise in microwave plasma sources and their application to high-volume manufacturing, making him a respected contributor to the field of plasma-assisted materials processing.
Research Focus
Key Achievements
Top Papers
- 1Plasma ashing using microwaves via slot antenna for 300-mm wafers2 citations · 1999