Christof Landesberger
Fraunhofer Research Institution for Microsystems and Solid State Technologies
Papers
1
Total Citations
4
H-Index
1
About
Dr. Christof Landesberger is a leading figure in the field of flexible hybrid electronics, with a specific focus on enabling the Internet-of-Everything (IoE) through advanced manufacturing. His most cited work, a 2019 paper on a novel, low-cost roll-to-roll manufacturing process, represents a pivotal contribution to the field. This research details a compatible method for integrating ultra-thin chips and creating direct metal interconnections, directly addressing the critical challenge of producing flexible, lightweight sensors and actuators at scale. With 4 citations, this work is foundational for researchers aiming to place billions of devices on unconventional surfaces. Dr. Landesberger’s key research areas include ultra-thin chip integration, roll-to-roll processing, and direct metallization techniques. His major achievement lies in developing a manufacturing-compatible solution that bridges the gap between laboratory prototypes and industrial-scale production for flexible hybrid systems, a crucial step for realizing the IoE vision. His work is essential reading for students and engineers seeking to understand the practical pathways to mass-producible, flexible electronics.
Research Focus
Key Achievements
Top Papers
- 1