Surface-mount technology

A triple objective function with a Chebychev dynamic pick-and-place point specification approach to optimise the surface mount placement machine

Masri Ayob, Graham Kendall

Citations: 33 • 2004

Printing Three-Dimensional Electrical Traces in Additive Manufactured Parts for Injection of Low Melting Temperature Metals

John Swensen, Lael U. Odhner, Brandon Araki, Aaron M. Dollar

Citations: 30 • 2014

Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system

Ismail Fidan, R.P. Kraft, L.E. Ruff, Stephen Derby

Citations: 23 • 1998

Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Jennie S. Hwang

Citations: 20 • 2012

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

Ismail Fidan

Citations: 16 • 2004

Real-time scheduling for multi headed placement machine

Masri Ayob, Graham Kendall

Citations: 16 • 2004

Optimization of surface-mount permanent magnet synchronous machines for low duty-cycle, high-torque applications

Matthew G. Angle, Jeffrey H. Lang, James L. Kirtley, Sang-Bae Kim, David M. Otten

Citations: 11 • 2017

A new dynamic point specification approach to optimise surface mount placement machine in printed circuit board assembly

Masri Ayob, Graham Kendall

Citations: 11 • 2003

Automated rework of printed circuit board assemblies: Methods and procedures

Necdet Geren

Citations: 11 • 1996

Feature Extraction and Template Matching Algorithms Classification for PCB Fiducial Verification

Sameera Fonseka, J.A.K.S. Jayasinghe

Citations: 10 • 2018

Solder Paste Dispensing in Robotic SMD Rework

Necdet Geren, N.N. Ekere

Citations: 7 • 1994

Robotic soldering of lead free alloys

Kar Lin Chia, Ban Leong Choo, Sooi Jin Lee, Cynthia Tan Sok Luang, Ming Siew Tan, Thomas Truman

Citations: 6 • 2018

Study on the effect of fixtures on deformation and warpage of the double-sided flexible printed circuit board through reflow using DIC

Pradeep Lall, Kartik Goyal

Citations: 5 • 2017

Localization of component lead insidea THT solder joint for solder defectsclassification

C. L. S. C. Fonseka, J.A.K.S. Jayasinghe

Citations: 5 • 2017

A solder joint inspection system for surface mounted pin grid arrays

A. Kashitani, Norihiro Takanashi, Naoto Tagawa

Citations: 5 • 2002

Designed experiments to analyze the solder joint quality output of a SMD remanufacturing system

Ismail Fidan, R.P. Kraft, L.E. Ruff, Stephen Derby

Citations: 5 • 2002

Automated removal and replacement of surface mounted devices in electronic assembly

Necdet Geren

Citations: 4 • 1997

On designing an automated tool for capacitors removal from waste printed circuits boards

Ciprian Stamate, Ioan Doroftei, Daniel Chiriţa, Adrian Burlacu

Citations: 3 • 2019

High-precision surface mount assembly of micro-optical components per laser reflow soldering: positioning accuracy and thermal stability

Laurent Stauffer, Felix Walti, Urs Vokinger, K. Siercks

Citations: 3 • 2004

Justifying flexible automation for PCB assembly

Gregory W Holcomb

Citations: 3 • 1995