S. Bhatevara
Papers
2
Total Citations
8
H-Index
2
About
S. Bhatevara’s research focuses on advanced manufacturing processes for electronics packaging, particularly the development of low-cost, high-throughput material deposition techniques. Their major contribution lies in pioneering automated meniscus coating systems for large-area substrates used in multichip module (MCM) fabrication. Bhatevara demonstrated that meniscus coating offers significant advantages over conventional spin coating, including minimal material waste, faster processing, and the ability to coat large substrates—critical for reducing manufacturing costs in MCM-D and MCM-L technologies. Their work on an automated workcell for 24-inch packaging substrates addressed the industry’s need for coaters with sufficient throughput and material savings. Although their most-cited papers have modest citation counts (4 each), the practical impact of their innovations is evident in the push toward scalable, cost-efficient electronics manufacturing. Bhatevara’s research directly tackles the bottleneck of polymer deposition in large-area electronics, making their contributions valuable for engineers and researchers working on next-generation packaging and substrate technologies.
Research Focus
Key Achievements
Top Papers
- 1
- 2An automated workcell for meniscus coating on 24-in packaging substrates4 citations · 2001