Rao Tummala

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About

Rao Tummala is a pioneering figure in electronic packaging and systems integration, with a career spanning decades at the forefront of microelectronics innovation. His research focuses on low-cost, high-performance packaging technologies, particularly the development of large-area substrate fabrication for multichip modules (MCMs). Tummala’s major contributions include advancing automated manufacturing processes for thin-film coatings, such as the meniscus coating workcell for 24-inch substrates, which addressed critical industry needs for speed, material efficiency, and scalability. While his most-cited paper has 4 citations, his broader body of work—including seminal contributions to the "System on Package" (SOP) concept—has garnered thousands of citations and shaped modern packaging. As a Distinguished Professor at Georgia Tech and founder of the NSF-funded Packaging Research Center, Tummala has mentored generations of engineers and authored the widely used textbook *Fundamentals of Microsystems Packaging*. His achievements include over 70 patents, numerous IEEE awards, and induction into the National Academy of Engineering, cementing his legacy as a transformative leader in electronic systems integration.