Robotic Wafer Handling Systems for Integrated Circuit Manufacturing: A Review

摘要

This paper surveys robotic wafer handling system for integrate circuit manufacturing,and reviews the operating principle and research results of the main components of the system,i.e.,wafer robot and prealigner.It also discusses the key technologies of robotic wafer handling system,including direct drive,magnetic fluid seals,magnetic coupling,tra-jectory planning,control technology,calibration and gripping.