Sung Hun Jin

Papers

Total Citations

435

H-Index

About

Sung Hun Jin is a leading figure in the field of stretchable electronics and advanced microassembly, with a core focus on the mechanics of adhesion and deterministic assembly. His most influential work, a 2010 study on microstructured elastomeric surfaces, has garnered over 435 citations, fundamentally advancing the science of reversible adhesion. In this seminal paper, Jin and his colleagues demonstrated how pressure modulation can precisely control adhesion between stiff objects and elastomeric stamps, providing a critical mechanism for transfer printing. This breakthrough has enabled the reliable assembly of fragile, high-performance inorganic materials onto flexible substrates, a cornerstone technology for next-generation wearable sensors, electronic skins, and flexible displays. Beyond this landmark contribution, Jin’s research portfolio spans thin-film transistors, bio-integrated electronics, and novel manufacturing processes. His work is distinguished by its rigorous theoretical modeling paired with elegant experimental validation, making complex physical phenomena accessible for practical engineering. Through his deep exploration of adhesion mechanics, Jin has provided the foundational toolkit that allows researchers to deterministically place micro- and nanoscale components, directly enabling the scalable fabrication of advanced, heterogeneously integrated flexible electronic systems.