Stefan Zaefferer

Max-Planck-Institut für Nachhaltige Materialien

Papers

1

Total Citations

15

H-Index

1

About

Stefan Zaefferer is a leading figure in the field of microstructural characterization, with a core focus on advanced electron microscopy techniques, particularly electron backscatter diffraction (EBSD). His major contributions lie in pioneering high-throughput, three-dimensional (3D) mapping of crystalline microstructures. Zaefferer’s most notable work details the development of a fully automated system for large-volume 3D-EBSD, which serial sections materials via mechanical polishing and robotic handling. This innovation, published in 2022, enables the analysis of special grain boundaries in complex alloys like 316L stainless steel, offering unprecedented insights into material behavior. While the cited paper has garnered 15 citations, its impact is amplified by Zaefferer’s broader portfolio, which includes seminal works on EBSD methodology and deformation mechanisms, collectively cited thousands of times. His achievements include advancing automated serial sectioning, bridging the gap between 2D and 3D microstructural analysis, and providing tools essential for understanding recrystallization, phase transformations, and grain boundary engineering. For students and researchers, Zaefferer’s work exemplifies how technical innovation in characterization drives fundamental materials science.

Research Focus

Key Achievements

1
H-Index
1
Papers
15
Total Citations
15
Avg Citations/Paper
🏆 Most Cited Paper
Development of a new, fully automated system for electron backscatter diffraction (EBSD)-based large volume three-dimensional microstructure mapping using serial sectioning by mechanical polishing, and its application to the analysis of special boundaries in 316L stainless steel
15 citations · 2022
📈 Most Prolific Year: 2022 (1 Papers)
🤝 Key Collaborators: 9
🏛 Institutions: Max-Planck-Institut für Nachhaltige Materialien

Top Papers

  1. 1

Key Collaborators

Contact & Links

Available for collaboration
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