Hung‐Chun Kuo
Papers
1
Total Citations
4
H-Index
1
About
No biography available yet.
Research Focus
Application-specific integrated circuit1 · 4 citations
Ball grid array1 · 4 citations
Chip1 · 4 citations
Chip-scale package1 · 4 citations
Computer science1 · 4 citations
Die (integrated circuit)1 · 4 citations
Electrical engineering1 · 4 citations
Electronic engineering1 · 4 citations
Embedded system1 · 4 citations
Engineering1 · 4 citations
Interposer1 · 4 citations
Layer (electronics)1 · 4 citations
Key Achievements
1
H-Index
1
Papers
4
Total Citations
4
Avg Citations/Paper
🏆 Most Cited Paper
Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application
4 citations · 2019
📈 Most Prolific Year: 2019 (1 Papers)
🤝 Key Collaborators: 4
🏛 Institutions: Advanced Semiconductor Engineering (Taiwan)
Top Papers
- 1
Key Collaborators
Not generated yet