Hung‐Chun Kuo

Advanced Semiconductor Engineering (Taiwan)

Papers

Total Citations

H-Index

About

Hung-Chun Kuo is a leading researcher in advanced semiconductor packaging and high-performance computing (HPC) systems, with a focus on ultra-high-density interconnect design and electrical analysis. His work addresses the critical demands of emerging technologies such as the Internet of Things (IoT), artificial intelligence (AI), autonomous driving, and robotics, where high bandwidth and low latency are essential. Kuo’s key contributions include pioneering electrical analysis techniques for complex package architectures, enabling the integration of multiple dies with superior signal integrity and power delivery. His most-cited paper, "Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application" (2019), has garnered attention for its practical insights into next-generation packaging solutions. While his citation count is still growing, Kuo’s research is recognized for its direct impact on the semiconductor industry’s push toward miniaturization and performance scaling. His work is particularly notable for bridging the gap between theoretical modeling and real-world HPC applications, making him a valuable contributor to the future of advanced packaging technologies.