Heiko O. Jacobs
Papers
5
Total Citations
83
H-Index
4
About
Heiko O. Jacobs is a pioneering researcher in the field of directed self-assembly and advanced manufacturing of semiconductor devices, with particular expertise in fluidic self-assembly, flexible electronics, and microscale fabrication. His work has fundamentally advanced the integration of semiconductor chiplets onto flexible substrates without relying on conventional robotic pick-and-place methods, offering scalable, cost-effective alternatives for next-generation electronics manufacturing. Among his most celebrated contributions is the development of roll-to-roll and reel-to-reel fluidic self-assembly systems, which leverage surface tension and geometric shape recognition to precisely capture, align, and electrically connect light-emitting diodes and other semiconductor components at scale. His 2015 work demonstrating millimeter-thin, rubber-like solid-state lighting modules — assembled entirely through fluidic processes — garnered 34 citations and exemplifies his ability to bridge fundamental science with practical applications. Earlier foundational work on shape-and-solder directed self-assembly of packaged microsystems demonstrated the breadth of his approach across material boundaries and length scales. Jacobs' research has inspired a generation of scientists working at the intersection of nanofabrication, flexible electronics, and scalable manufacturing, establishing him as a key innovator in chiplet assembly technologies with lasting influence on the field.
Research Focus
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