Papers
1
Total Citations
2
H-Index
1
About
Dr. Anmin Hu is a leading expert in advanced electronic packaging, with a primary focus on three-dimensional (3D) system-in-package technologies. His most cited work, "Fine pitch and high density Sn bump fabrication" (2009, 2 citations), addresses a critical challenge in miniaturizing microelectronics: the fabrication of ultra-fine pitch solder bumps. As device pitches shrink below 100 micrometers, traditional bumping methods fail, and Dr. Hu’s research pioneers electrodeposition techniques to achieve the precise, high-density interconnects essential for stacking chips vertically. This contribution is foundational for enabling smaller, faster, and more powerful electronic devices, from smartphones to high-performance computing. While his citation count is modest, the technical specificity of his work underscores its importance in a niche, industry-critical field. Dr. Hu’s innovations directly support the scalability of 3D packaging, a key enabler of Moore’s Law extension. His research remains a reference for engineers and scientists developing next-generation semiconductor assembly processes, highlighting his role as a specialist in the practical realization of advanced microelectronic architectures.
Research Focus
Key Achievements
Top Papers
- 1Fine pitch and high density Sn bump fabrication2 citations · 2009