Chip-scale package
相关论文数: 2
顶级研究者
最高引用论文
Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials
Yu Lung Huang, C. Key Chung, C. F. Lin, Kuo Haw Yu, Rung Jeng Lin, Wilson Hong
引用数: 6 • 2021
Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application
Tsun-Lung Hsieh, Hung‐Chun Kuo, Ming-Fong Jhong, Chih-Yi Huang, Chen-Chao Wang
引用数: 4 • 2019