Jian‐Cheng Lai

Stanford University, Collaborative Innovation Center of Advanced Microstructures

论文数

6

总引用数

1,374

H-Index

6

关于

暂无简介。

研究焦点

Materials science6 · 1,374 次引用

Nanotechnology6 · 1,374 次引用

Computer science3 · 1,272 次引用

Optoelectronics3 · 902 次引用

Electrical engineering3 · 902 次引用

Engineering1 · 707 次引用

Electronic skin1 · 707 次引用

Neuromorphic engineering1 · 707 次引用

Artificial neural network1 · 707 次引用

Electronic engineering1 · 707 次引用

Artificial intelligence1 · 707 次引用

Piezoresistive effect1 · 707 次引用

主要成就

6

H 指数

6

论文

1,374

总引用数

229

篇均引用

🏆 最高被引论文

Neuromorphic sensorimotor loop embodied by monolithically integrated, low-voltage, soft e-skin

707 次引用 · 2023

📈 最高产年份: 2023 (2 论文)

🤝 主要合作者: 58

🏛 所属机构: Stanford University, Collaborative Innovation Center of Advanced Microstructures

代表论文

1
Neuromorphic sensorimotor loop embodied by monolithically integrated, low-voltage, soft e-skin
707 次引用 · 2023
2
An Elastic Autonomous Self‐Healing Capacitive Sensor Based on a Dynamic Dual Crosslinked Chemical System
393 次引用 · 2018
3
Autonomous alignment and healing in multilayer soft electronics using immiscible dynamic polymers
172 次引用 · 2023
4
An Integrated 3D Hydrophilicity/Hydrophobicity Design for Artificial Sweating Skin (i‐TRANS) Mimicking Human Body Perspiration
54 次引用 · 2022
5
Shape-memory-assisted self-healing of macroscopic punctures via high-energy-density periodic dynamic polymers with tunable actuation temperature
25 次引用 · 2024
6
A Transparent, Patternable, and Stretchable Conducting Polymer Solid Electrode for Dielectric Elastomer Actuators
23 次引用 · 2024

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